APPLICATION TECHNOLOGY
LOW TEMPERATURE / LNG
SEMIMCONDUCTOR
INDUSTRY
GASDry ice snow cleaning system
瞬時起動型 QS-1001
クリーンスノー型 QS-A1321F-RTechnical summary
A cleaning technology to remove particles and organic substances by bombarding dry-ice particulates, which are generated inside the system by supplying liquefied carbon dioxide, onto a part to be cleaned at high speed.
特徴
Dry process: No need for drying step nor waste water/solution processing
Minimizing damage to a part to be washed
By controlling flow rate and particle size of the dry ice, appropriate washing for a specific purpose is possible.
Free from temperature shock (condensation) with temperature control for injection gas
Minimizing damage to a part to be washed
By controlling flow rate and particle size of the dry ice, appropriate washing for a specific purpose is possible.
Free from temperature shock (condensation) with temperature control for injection gas
Washing principles
Washing is achieved by the physical effects upon collision between the particles and a part to be washed
Washing is achieved by the solubility occurring during re-liquefaction of CO2 (mainly for organic substances)
Washing is achieved by the solubility occurring during re-liquefaction of CO2 (mainly for organic substances)
Applications
Removal of particles (from submicron-order to micron-order)
Removal of organic substances
Adaptation example
| Semiconductor devices | Image sensors (CMOS/OCD) |
|---|---|
| FPD substrates | Glass substrates (glass substrates for liquid crystal), organic EL substrates |
| Electronic components | Hard-disk drive (HDD) components (cases, spindle motors, etc.), relay components, touch panel-related products |
| Semiconductor devices | Lenses for optical communications |
Adaptation example
Spot typeSpot type
Multi-nozzle typeMulti-nozzle type
Wide angle type/em>Wide angle type