Atmospheric pressure plasma direct type surface treatment device
  Application
      Improving film wettability and adhesiveness
    
  Feature
・Enables uniform treatment, even with economical nitrogen gas (N2) (lowering running costs)
・Compact, light, and easy-to-handle
・Achieving high-throughput with high-speed, continuous treatment
・Supporting any kind of surface modification based on accumulated know-how on gas species
          
  ・Compact, light, and easy-to-handle
・Achieving high-throughput with high-speed, continuous treatment
・Supporting any kind of surface modification based on accumulated know-how on gas species
Specification
| Treatment speed | maximum 50m/min | 
|---|---|
| Film width | maximum 1,000mm | 
| Film thickness | 10 ~ 125 μm | 
| Process Gas | Various kinds of gas, including nitrogen, argon, helium, and oxygen | 
APPLICATION TECHNOLOGY
LOW TEMPERATURE / LNG
SEMIMCONDUCTOR
INDUSTRY
GAS